天津飞思卡尔半导体诚招Electronic Material Packaging Engineer一名？NXP（飞思卡尔半导体）诚招材料研发工程师一人，外企，老板是外国人，人超级nice。半导体行业，薪资福利好，外企工作氛围良好，与global 部门联系紧密。 希望将要博士毕业的同学踊跃报名，如果您是金属材料专业毕业，有兴趣进去半导体行业，为芯片事业而努力，喜欢研究，撰写文章，发表专利。与外国人交流，拓宽国际视野，欢迎加入我们，我们期待您的到来！ 职位介绍与专业要求如下： NXP’s Technology & Operations (T&O) organization plays an essential role in the company’s success by ensuring the delivery of high quality, scalable, cost-competitive technologies and supply to create a competitive advantage for our customers. The Packaging Innovation (PI) organization in T&O is responsible for the implementation of packaging solutions for new product introduction and new technology development for electronic packages for the varied business product lines; Automotive Processing, Sensor, Edge Processing, Radar Processing, Radio Powers, Radio Frequency, Connectivity and Security. Job Summary Define and validate package designs, materials and processes used for development of new products for NXP. Develop DOE’s and tests to evaluate suitability and reliability of package solutions. Work with Product Business Lines, Global Package Innovation teams, Process engineering (both internal to NXP and subcons) and Suppliers to establish and conduct physical / chemical material selection characterizations for new materials and qualify the product-package solutions. Establish a strong understanding to certify reliable solutions of different metals and alloys integrated into IC leaded and laminate packaging systems. Apply advanced methods and technologies to research metal and plating properties improving techniques. Establish applicable analytical tools and test methodologies to ensure plating / metal integration. Manage the package process using industry standard project management tools. Develop solutions by working closely with Package Innovation teams (Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing). Address and solve materials and processing issues that may occur during the development process. May involve international travel to package assembly sites and NXP suppliers. Job Qualifications PhD. in Materials Science or Metallurgical Engineering. Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required. Strong Problem-solving skills determining innovative ways to improve processes and resolve issues related to manufacturing and design Working knowledge of various IC packages like QFP, QFN, BGA, flip chip, wafer level fan-in and fan-out is a plus. Knowledge of Statistical Analysis and Design of Experiment is a plus. Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally. 公司网站以及更多职位要求，欢迎访问：https://nxp.wd3.myworkdayjobs.co ... Engineer_R-10022617查看更多1个回答 . 6人已关注
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